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Heatsink selection

Device selection brings electrical loading, switching behaviour and heat removal together. Explore the considerations for your equipment.

SF air-cooled heatsinks

SF air-cooled heatsinks

This air-cooled heatsink is extruded from high-purity aluminium alloy and has an anodised surface, providing excellent thermal conductivity and corrosion resistance. Its symmetrical, double-sided comb-fin design supports clamping on both sides and double-sided cooling of high-power disc-type devices such as KP and KK thyristors. Copper busbar connection terminals and insulating fasteners are included to reduce contact thermal resistance effectively. It is mainly used for mounting and cooling key devices in high-power rectifier cabinets, medium-frequency induction heating power supplies, industrial electric furnaces, high-power frequency converters and soft starters. Select according to device power losses, mounting clamping force, thermal resistance requirements and forced-air or natural-air cooling conditions.

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SS water-cooled heatsinks

SS water-cooled heatsinks

This water-cooled heatsink is machined from high-thermal-conductivity metal and incorporates efficient internal water-cooling channels. The standard configuration includes water inlet and outlet connections, a Belleville spring clamping mechanism, high-strength insulating tie rods and a yellow insulating locating ring, supporting double-sided water cooling and secure clamping of high-power disc-type devices such as KP and KK thyristors. It features very high heat dissipation efficiency, low thermal resistance, compact dimensions and good electrical insulation. Main applications include very-high-power rectifier power supplies, high- and medium-frequency induction heating, electrolysis and electroplating, large motor soft starting, and rail traction converters. Select according to device power losses, mounting clamping force, cooling-water flow, pressure and water quality requirements.

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Selection considerations

Heatsink selection requires checking mounting dimensions and contact geometry, device losses and operating conditions. For air cooling, review airflow and ambient temperature; for water cooling, confirm connections and coolant requirements.

Heatsink Selection for Power Semiconductor Modules

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