Fuzheng Electronic

SF

SF air-cooled heatsinks

This air-cooled heatsink is extruded from high-purity aluminium alloy and has an anodised surface, providing excellent thermal conductivity and corrosion resistance. Its symmetrical, double-sided comb-fin design supports clamping on both sides and double-sided cooling of high-power disc-type devices such as KP and KK thyristors. Copper busbar connection terminals and insulating fasteners are included to reduce contact thermal resistance effectively. It is mainly used for mounting and cooling key devices in high-power rectifier cabinets, medium-frequency induction heating power supplies, industrial electric furnaces, high-power frequency converters and soft starters. Select according to device power losses, mounting clamping force, thermal resistance requirements and forced-air or natural-air cooling conditions.

Models 7

Selecting SF air-cooled heatsinks

SF aluminium air-cooled heatsinks provide thermal management for power semiconductor assemblies. Select a heatsink by matching its mounting and contact geometry to the device, then evaluate airflow, ambient temperature and device losses together. Mechanical fit alone does not confirm cooling suitability; the assessment must reflect the airflow and operating conditions of the actual assembly.

  • Compare mounting dimensions and contact geometry with the device and the planned mechanical assembly.
  • Confirm the airflow available at the heatsink under the intended installation and operating conditions.
  • Evaluate device losses and ambient temperature together with airflow before confirming the cooling arrangement.

Questions before ordering

What should I include in an enquiry?

Compare mounting dimensions and contact geometry with the device and the planned mechanical assembly. Confirm the airflow available at the heatsink under the intended installation and operating conditions. Evaluate device losses and ambient temperature together with airflow before confirming the cooling arrangement.

Can a heatsink be selected using dimensions alone?

SF aluminium air-cooled heatsinks provide thermal management for power semiconductor assemblies. Select a heatsink by matching its mounting and contact geometry to the device, then evaluate airflow, ambient temperature and device losses together. Mechanical fit alone does not confirm cooling suitability; the assessment must reflect the airflow and operating conditions of the actual assembly.

Which documents should I request?

Identify the model-specific datasheet, dimensional drawing, test records and any market-specific compliance evidence your project requires. Confirm their scope with the quotation.

Let us review your next requirement.

Send the model or drawing, quantity, electrical conditions, cooling method and destination. Include your company name and the intended application.

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