SF12SF air-cooled heatsinks
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SF air-cooled heatsinks
SF13
This air-cooled heatsink is extruded from high-purity aluminium alloy and has an anodised surface, providing excellent thermal conductivity and corrosion resistance. Its symmetrical, double-sided comb-fin design supports clamping on both sides and double-sided cooling of high-power disc-type devices such as KP and KK thyristors. Copper busbar connection terminals and insulating fasteners are included to reduce contact thermal resistance effectively. It is mainly used for mounting and cooling key devices in high-power rectifier cabinets, medium-frequency induction heating power supplies, industrial electric furnaces, high-power frequency converters and soft starters. Select according to device power losses, mounting clamping force, thermal resistance requirements and forced-air or natural-air cooling conditions.
- Dimensions
- 220mm × 120mm × 127mm
- Weight
- < 4 kg
- Material
- Aluminium
EM-product-1791336326753-8w3n-1t5
Technical details
- Model
- SF13
- Dimensions
- 220mm × 120mm × 127mm
- Weight
- < 4 kg
- Material
- Aluminium
- Minimum order quantity
- 200
- Dimensional drawing
- XSF13
- Cooling
- Air cooling
- Outline dimension L
- 220 mm
- Outline dimension D
- 120 mm
- Outline dimension H
- 127 mm
- Busbar width
- 40 mm
- Busbar thickness
- 8 mm
- Device mounting gap
- 45 mm
- Clamping rod centre distance
- 90 mm
- Busbar mounting holes
- 2 × Φ13 mm
- Threaded mounting holes
- 2 × M6
- Mounting thread depth
- 20 mm
- Parameter scope and test conditions
- XSF and SF identify the same model. Linear dimensions are in mm; refer to the model drawing for hole positions and other mounting dimensions.
- Parameter source
- SF13 / XSF13 · Dimensional drawing
Questions before ordering
What should I include in an enquiry?
Compare mounting dimensions and contact geometry with the device and the planned mechanical assembly. Confirm the airflow available at the heatsink under the intended installation and operating conditions. Evaluate device losses and ambient temperature together with airflow before confirming the cooling arrangement.
Can a heatsink be selected using dimensions alone?
SF aluminium air-cooled heatsinks provide thermal management for power semiconductor assemblies. Select a heatsink by matching its mounting and contact geometry to the device, then evaluate airflow, ambient temperature and device losses together. Mechanical fit alone does not confirm cooling suitability; the assessment must reflect the airflow and operating conditions of the actual assembly.
Which documents should I request?
Identify the model-specific datasheet, dimensional drawing, test records and any market-specific compliance evidence your project requires. Confirm their scope with the quotation.
